Guidelines
| NEDA Guidelines | NEDA Position and White Papers |
NEDA Guidelines
- NIGP 101.01: Guidelines for Commercial Semiconductor Packaging and Labeling
- Superceded by JEP 130
- NIGP 102: Guidelines for Unit Packing for Integrated Circuits - Tubes (Rails)
- Superceded By JEP 130
- NIGP 103: Guidelines for Identification and Labeling of Moisture Sensitive Integrated Circuits
- Superceded by JEP 113-XX
- NIGP 104: Guidelines for the Packing and Handling of Moisture Sensitive Integrated Circuits
- Superceded by JEP 124
- NIGP 105: Handling Guidelines for Moisture Sensitive Plastic Surface Mount Components
- Superceded by JEP 124
- NIGP 106b: Handling Guidelines for the Transference of Tray-Packaged ICs
- NIGP 107: Guidelines for the Format of Military Certificates of Conformance
- NIGP 108: Guidelines for Packing & Dunnage of Electronic Components
- NIGP 109: Guidelines for Distributor Assessment of Manufacturer Performance
- NIGP 110: Technical Guidelines for Electronic Price/Sales Catalog
- NIGP 111: Guidelines for the Format of Packing Slips
- NIGP 112: NEDA Guidelines for Auto Identification
(1-Dimensional Bar Code & 2-Dimensional Matrix Code for Suppliers
Product Package & Shipment Labeling) - NEDA Guidelines for Effective Vendor Sales Meetings